What is a fcBGA package?

Published by Anaya Cole on

What is a fcBGA package?

The fcBGA package is the main platform in flip Chip package family, which includes bare die, a thermally enhanced type with one/two piece heat spreader or lid (Lidded fcBGA), SiP (SiP fcBGA) types and a package subsystem meeting the standard BGA footprint that contains multiple components within the same package (MCM …

What is BGA and PGA?

LGA packaging is related to ball grid array (BGA) and pin grid array (PGA) packaging. Unlike pin grid arrays, land grid array packages are designed to fit either in a socket, or be soldered down using surface mount technology. PGA packages cannot be soldered down using surface mount technology.

What is a flip chip MTB?

The flip chip allows riders to quickly adjust the geometry of their Maestro-equipped mountain bike to better suit how and where they ride. It lets riders change the headtube/seattube angles and bottom bracket height via eccentric (offset, two-position) hardware located on the upper rocker arm.

Is flip chip same as BGA?

Flip chip BGA (FCBGA) is similar to BGA, except it is internal to the package and flip chip die is used. The key disadvantages of BGAs remain the same, i.e., inspectability for interconnection cracks and individual ball reworkability. Only peripheral balls/columns can be inspected easily.

What is the purpose of flip chip?

The flip chip allows riders to quickly adjust the geometry of their Maestro-equipped mountain bike to better suit how and where they ride. It lets riders change the headtube angle, seattube angle and bottom bracket height using eccentric (offset, two-position) hardware located in the upper rocker arm.

What is Wlcsp?

WLCSP is a true chip-scale packaging (CSP) technology, since the resulting package is of the same size of the die as shown in Figure 1. WLCSP technology differs from other ball-grid array (BGA) and laminate-based CSPs in that no bond wires or interposer connections are required.

What is the typical packaging efficiency of CSP?

In the past, CSP’s have been defined as a package that is 1.2X the size of the die. However, some types of CSPs maintain their package size as the internal silicon die reduces in size as a result of the fabrication lithography process gets smaller (die shrink).

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